Chipmaking resources are scarce, and factories running on newer processes producing smaller transistors, such as 14nm, are best deployed to maximize profits. Why are we talking about chipmaking factories? Well, it’s to help explain why Intel shifted back to a 22nm process for its latest Intel chipset, the B365.

Intel Chipset Inside

What B365 is all about?

First, Intel shifted back to 22nm for this chipset compared to the more tightly packed chips utilized in the B360 chipsets which were made in 14nm fabs. This is in order to free up 14nm manufacturing space for making CPUs which earn more money compared to motherboard chipsets. Does it matter? Well not that much, your mainboard chipset does not do the heavy-duty work in your PC, it just manages stuff.

In other differences, the B365 leaves out the onboard WiFi and USB 3.1 controller that was included in the B360.  In effect, the B365 is a mid-range chipset which looks more like the Z170 and H270 chipsets than the B360 which is its numerical predecessor. It may appear like a downgrade, but it depends on your viewpoint as the B365 now includes 20 PCI Express 3.0 lanes which will be important to some users.

Intel Chipset Inside 2

Does any of this matter to you?

Chipsets can hardly take advantage of the differences in fabrication processes. A chipset fabricated on a 22nm process will do just about the same stuff as a chipset made to 14nm. It’s different for CPUs of course, smaller chips mean higher clock speeds, more cores, and less heat. The B365 leaves out some on-chip features to maintain its size but motherboard manufacturers can simply add a couple of chips to compensate.

In essence, we wouldn’t suggest that you worry too much about how Intel has chosen to package the B365 chipset. Just buy a motherboard that has the features that you require. If that includes onboard WiFi, for example, it may just mean that the manufacturer added it outside of the chipset. As for the production process of the chipset, this simply won’t make a difference.